The new ISO-Spector S3 series is a 5D Solder Paste Inspection (SPI) system offering a comprehensive suite of advanced features at a very low cost.
Measuring solder shapes, volume and offset, our SPI solution delivers easy programming, low maintenance and many customization options. Experience zero defects and zero downtime with the ISO-Spector S3 series.
The ISO-Spector S3 series SPI machines boast a range of features designed to improve efficiency and optimize the solder paste printing process:
3D projectors to calculate relative solder paste height via Moire pattern projections
Z axis auto-focus to compensate for PCB warp
360 degree ring light to isolate and clearly illuminate the inspection location
Resolution switching between low, medium, and high for flexibility in examining a greater variety of pads
Foreign material and glue detection, especially useful for wave soldered SMT
User-friendly GUI and touch screen
Bad mark communication between machines
Closed loop integration for better quality and efficiency
SPC and Mek Catch compatibility for fast issue diagnosis
Create inspection programs in as little as 3 minutes with Gerber data and easy offline programming
