RF-630 Reflow Soldering Conveyor

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RF-630
Heating section 6 Zones, 780mm(L)x300mm(W)x30mm(H at inlet)
Heating Method far infrared rays
Temperature control P.I.D. temperature controller, Max 350°C
Conveyor Method SUS mesh belt, 300mm wide
Speed 90 to 1400mm/min
Direction R → L or L → R (at user's request)
Cooling Forced cooling by a fan on the outlet side.
Power supply Single phase 200V About 6.7kW Single phase 220V About 7.8kW
Safety devices Leak/Over-current circuit breaker. Emergency stop switch. Alarm output (over/under temperature / heater disconnection)
External dimensions (W)1500×(D)590×(H)640mm
Weight about 140kg

Our Smallest Lead-Free Reflow Soldering Machine

The RF-630 is a small Reflow Soldering Machine capable of lead-free soldering. It uses infrared (IR) radiation for basic heating. Although this is a small table-top reflow machine, it uses a method with six far-infrared (IR) zones, and achieves the precise and stable temperature profile and other requirements of lead-free reflow soldering. It has a maximum temperature of 350°C and good solder wettability.

Features

  • This is a table-top reflow soldering machine using infrared. Circuit boards up to 300×300 mm can be processed.

  • Rapid heating is performed with a 6-zone quartz heater using far infrared radiation, and the desired temperature profile can be obtained.

  • Precise temperature control (± 0.3%) up to max. 350°C and stable temperature profiles can be obtained with a high-precision PID temperature controller.

Applicable Circuit Boards

  • Dimensions: 15mm×15mm to 300mm×300mm

  • Board thickness: 0.125mm to 2mm

  • Height: Max. 30mm

Applications

  • Reflow soldering of SMT circuit boards.

  • Lead-free reflow soldering.

  • Drying of thermosetting adhesives and other heating work.

Options

  • Finger chain conveyor.

  • External computer control.

Need a sales representative?

Japan Pulse Laboratories, Reflow SolderingGuest UserReflow Ovens