MS-100 Series Solder Printing Masks

MS-100
Stencil Size 14×28mm to 54×63mm (7 kinds)
Stencil Thickness 0.15mm or 0.13mm
Stencil Material SUS304
Frame Material SPCC
Options Squeegee (SQ-10, SQ-25, SQ-35, SQ-45)

Our Highly Applicable Metal Mask Micro Screen Series

The micro screen µS-100series are metal masks for printing solder paste (solder cream) onto single LSI such as QFP, CSP, and BGA. You can use this micro screen for printing as many as 50 different patterns, without printing machine. Solder paste application can easily, and securely be done in printing small lots of PC boards and reworking jobs. You can apply solder paste to QFP of 256pins/0.4mm pitch and BGA of 900pins easily and securely, using this low-cost standard micro screen.

Features

  • Solder paste can be applied only micro screen without printing machine.

  • About 50 kinds of patterns are carried as standard products, and also screen for BGA/CSP reballing is available.

  • The use in combination with screen printer Model SP-100, many PC boards can easily and repeatedly be printed.

  • In case that you require custom-made frame or screen, we can manufacture for you in a matter of 10 days.

  • Solder paste for micro screen and squeegee and ultrasonic cleanser are available.

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Japan Pulse Laboratories, Reflow SolderingGuest UserReflow Accessories Tools Stations