RF-430 Nitrogen Reflow Soldering Machine Series

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All Models
Heating section 4 zones, 980mm(L)x300mm(W)x50mm(H at inlet)
Heating Method far infrared rays
Temperature control P.I.D. temperature controller, Max 300°C
Conveyor Method SUS mesh belt, 300mm wide
Conveyor Speed 90 to 1400mm/min
Direction R → L or L → R (at user's request)
Cooling Forced cooling by a fan on the outlet side.
Power supply Single phase 200V About 6.7kW, Single phase 220V About 7.8kW
Safety devices Leak/Over-current breaker. Emergency stop switch. Alarm output (over/under temperature / heater disconnection).


M1/IR
Heating Gas Atmosphere
Convection Natural convection
External dimensions (W)1600×(D)660×(H)560mm
Weight about 140kg


M2/IRN2
Heating Gas Nitrogen(N2)
Convection Natural convection
External dimensions (W)1600×(D)660×(H)560mm
Weight about 140kg


M3/HA
Heating Gas Atmosphere
Convection Forced convection
External dimensions (W)1600×(D)660×(H)600mm
Weight about 180kg


M4/HAN2
Heating Gas Nitrogen(N2)
Convection Forced convection
External dimensions (W)1600×(D)660×(H)600mm
Weight about 180kg

Our Series of Soldering Machines Using the Power of Convection and Nitrogen Gas

The RF-430 is a small reflow soldering machine based on far-infrared and air heat convection. It is designed specially for nitrogen gas (N2). Because this particular series is of the IR 4 zone type, it allows for a stable temperature profile.

Models

RF-430 Model-1/IR IR+Natural convection system
RF-430 Model-2/IRN2 IR+N2 system
RF-430 Model-3/HA IR+Hot air convection system
RF-430 Model-4/HAN2 IR+N2 convection system

Features

  • This is table top type N2 reflow soldering machine. (O2 density : about 5000ppm)

  • The heating source is IR and hot air heat convection, consisting of 4 zone heating sections.

  • In future you can modify the basic model to the model applicable to N2. (with manufacturer's assistance)

Applicable Circuit Boards

  • Dimensions: 15mm×15mm to 300mm×300mm

  • Board thickness: 0.1mm to 2mm

  • Height: Max. 50mm

Applications

  • Reflow soldering of H-IC and SMT circuit boards.

  • Reflow soldering for non-cleanse type cream soldering. (Model-2/4)

  • Drying of thermosetting adhesives and other heating work.


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