RF-221 Chip Reflow Oven
| RF-221 | |
|---|---|
| Heating section | 2 zones, 400mm(L)x140mm(W)x20mm(H at time of sub-heater use) |
| Heating Method | Hot plate |
| Temperature control | P.I.D. temperature controller, Max 270°C |
| Conveyor Method | Teflon belt, 140mm wide |
| Conveyor Speed | 140 to 1040mm/min (Analog) |
| Conveyor Direction | L → R |
| Cooling | Natural cooling. |
| Power supply | Single phase 120/220V 720W |
| External dimensions | (W)800×(D)370×(H)234mm |
| Weight | approximately 25kg |
Our Number-One Chip Soldering Device
This machine is very easy to use. Simply apply cream solder on the board, mount chip parts thereon, and place it on the conveyer. All chip parts will be reflow soldered in approximately 2 minutes! This machine is best used for production of small boards with mounted chip parts Use of the optional top sub-heater allows easy reflow soldering of SOP and CSP, and more.
Features
Being very economically priced, it can be used for small production quantities.
Desk-top type and compact but capable of handling up to 140mm wide board.
Provided with the Teflon belt conveyer, heat efficiency can be enhanced, thus allowing energy saving.
Power consumption is as small as 1kW, connectable to ordinary wall sockets.
Use of the sub-heater makes possible reflow soldering of parts with larger heat capacity, such as SOP, CSP, etc., with high efficiency.
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