Rebcom RBC Solder Paste Printing and Reballing
Reballing and solder paste printing in one simple, reliable machine.
RBC-1 and RBC-100 are simple, elegant tools made for consistent, high-quality reballing and solder paste printing via a simple and easily repeatable process.
These tools are full-featured devices able to cover every step of the process. With guiding pins designed to be a one-touch positioning mechanism, no-touch transfer tools to keep work surfaces clean, a dedicated heating stage for stable reball heating, and a number of apertures able to work with numerous masks and prevent warping, these machines rigorously. And with the option for addtional suction tables and suction fixed rings, our devices can handle work pieces that are warped , uneven, or even smaller than 3mm in diameter. Perfect your SMT technologies, including CSP, LGA, BSP, and many more.
Make your production process streamlined and reliable with streamlined, reliable tools from the Rebcom RBC series.
Click here for the technical specifications pdf.
Features
Solder ball diameters of 0.1mmφ to 0.76mmφ are supported, and 0 to 5mm in the z axis.
Work with packages from 3mm to 100mm in diameter depending on model. Inquire about suction fixturing for small work pieces.
The screen position (X, Y, Z) can be fine-adjusted with 10µm accuracy based on the micro meter.
These reliable, low cost machines come with multiple warranty options and are supported by a robust service plan including a free adjustment and inspection, as well as free rental machines until your unit is ready to be returned to action.
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