Hurricane HY-D620
| HY-D620 | |
|---|---|
| Input Voltage | AC220V±10% 50/60HZ 1.5KW |
| Dimensions | 1030x1200x1600mm |
| Weight | About 700KG |
| Light source | LED RGB Ring Light Source |
| Image recognition | Outline recognition, color and grey analysis, image comparison |
| Camera | High grade imported digital color CCD camera, 5m pixels |
| Resolution for X-Y axis | 15/20um optional |
| Max Warpage | 2% of PCB's diagonal or < 5mm |
| Inspection window size | FOV 30x20mm |
| Min size available component | 0201/01005 |
| Special feature | For precesie defective marking (internal or external ink jet marking) |
| Hardware | |
|---|---|
| Available PCB Size | 50mmx50mm ~ 400mmx350mm |
| PCB Thickness | ≤ 6mm |
| Max PCB Weight | ≤ 3KG |
| Max PCB Height | Above ≤ 85mm, bottom ≤ 35mm |
| PCB holding edge | ≥ 3.5mm |
| Working height | Transfer track from ground: 900±20mm |
| Conveyor speed | 750mm/s(MAX) |
| Conveyor direction | Standard: left-right; Optional: right-left |
| Conveyor control | Automatic |
Our DIP Inline Automatic Optic Inspection Machine
The HY-D620 is a powerful machine that uses automatic optical inspection (AOI) to visually inspect soldered PCB boards. With its specialized technologies, it can easily be implemented in any production line to keep your inspections fast and precise. The HY-D620 is extremely accurate, with a defect detection rate of over 99.9% and a rate of false alarms of less than 1%.
This machine can be combined with other Hurricane machines to form our powerful Fully Automatic DIP Production Line. For more information on this efficient, highly recommended system, click here.
What is automatic optical inspection?
Automatic optical inspection (AOI) refers to automated visual inspection of a printed circuit board. In AOI, the camera scans the board for problems, whether catastrophic (such as a missing component), or quality defects (such as fillet size, shape, or component skew). It’s popular because it is a non-contact test method, and is used at many stages in the manufacturing process - bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow, and more. However, historically, it’s been used primarily after solder reflow as a post-production tool. This is because the machine can inspect for many types of defects at once, allowing faulty boards to be reworked, and the others sent to the next step.
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| Software | |
|---|---|
| Operating system | Windows 7 or above |
| Language | Chinese/English |
| Monitor | 22-inch color monitor |
| Detectable Solder Paste Defects | Missing, shifting, lack, too much, open/short, contamination, etc |
| Detectable Component defects | missing, shifting, skewing, thumb up, side up, turned over, wrong (OCV), damaged, reversing, soak solder, glue squeeze-out, etc |
| Detectable Soldering Defects | too much or too little solder paste, fake soldering, bridging, contamination, etc |
| NG indication | OK/NG marking, PCB ID, status, component name, status and failure picture, defective location |
| Programming | support general parts library and CAD data input |
| Analysis output | Auto create SPC and data |
| Off-line programming | Support (CAD) |