BM-11 Low Cost Solder Ball Jig for BGA, CSP, MCM+

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Specifications

Ball mounting screen
Material SUS304
Dimensions 40×40mm, 50×50mm, 60×60mm, 70×70mm


Package holder
Material Aluminum or Magnesium
Dimensions 50×50mm, 60×60mm, 70×70mm, 80×80mm
Thickness 2mm, 3mm
Weight 2 - 10g

Our Easiest-to-Use Ball Terminal Mounting System

The BM-11 is a jig for easy mounting of terminal solder balls on BGA, CSP, MCM, etc. Even beginners can easily carry out re-balling. Cavity-Down which were difficult until now can be easily carried out. Moreover, the price constitutes less than one tenth of the previous models.

Features

  • Using the special holder and screen arranged separately for each of the BGA, CSP, MCM, etc. packages, anyone can easily mount solder balls. Operation is easy while the price is less the one tenth of the previous models.

  • Cavity-Down which were difficult until now can be easily carried out.

  • No need for complicated flux/cream solder printing and screen adjustment.

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Japan Pulse Laboratories, Ball Mount Soldering, Reflow SolderingGuest UserBall Mount Equipment