The SP-100BR is machine for mounting ball terminals on BGA, CSP, MCM and other packages by useing a microscreen (µS-100series, option). lts applicability ranges from CSP with 30 pins to MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. With the machine it is easy to mount ball terminals on a small quantity of packages when reballing on reprocessed packages, or when mounting balls on newly developed chips, etc.
|Fine-adjustment of X,Y,Z||15mm (10µm steps)|
|Power supply||AC120V or 220V 10VA 50/60Hz|
|Main unit||(W)250×(D)450×(H)160mm 8kg|
|Control box||(W)170×(D)220×(H)110mm 2kg|
|µS-100 series (option)|
|Size||14×28mm to 54×63mm (7 kinds)|
|Thickness||0.15mm or 0.13mm|