This machine is very easy to use. Simply apply cream solder on the board, mount chip parts thereon and place it on the conveyer, so that all chip parts can be reflow soldered in approx. 2min. It is useful for production of small boards with chip parts mounted. Use of the optional top sub-heater allows easy reflow soldering of SOP and CSP, etc.
Heating section | Zones | 2 |
---|---|---|
Length | 400mm | |
Width | 140mm | |
Height | 20mm (At the time of sub-heater use.) | |
Heating | Method | Hot plate |
Temperature control | P.I.D. temperature controller. | |
Max temperature | 270°C | |
Conveyor | Method | Teflon belt. |
Width | 140mm | |
Speed | 140 to 1040mm/min (Analog) | |
Direction | L → R | |
Cooling | Natural cooling. | |
Power supply | Single phase 120/220V 720W | |
External dimensions | (W)800×(D)370×(H)234mm | |
Weight | about 25kg |