RF-221

Chip Soldering

Product Catalog

Product Video

This machine is very easy to use. Simply apply cream solder on the board, mount chip parts thereon and place it on the conveyer, so that all chip parts can be reflow soldered in approx. 2min. It is useful for production of small boards with chip parts mounted. Use of the optional top sub-heater allows easy reflow soldering of SOP and CSP, etc.

Features

Being very economically priced, it can be used for small production quantities.
Desk-top type and compact but capable of handling up to 140mm wide board.
Provided with the Teflon belt conveyer, heat efficiency can be enhanced, thus allowing energy saving.
Power consumption is as small as 1kW, connectable to ordinary wall sockets.
Use of the sub-heater makes possible reflow soldering of parts with larger heat capacity, such as SOP, CSP, etc., with high efficiency.

Specifications

Heating section	Zones	2
	Length	400mm
	Width	140mm
	Height	20mm (At the time of sub-heater use.)
Heating	Method	Hot plate
	Temperature control	P.I.D. temperature controller.
	Max temperature	270°C
Conveyor	Method	Teflon belt.
	Width	140mm
	Speed	140 to 1040mm/min (Analog)
	Direction	L → R
Cooling		Natural cooling.
Power supply		Single phase 120/220V 720W
External dimensions		(W)800×(D)370×(H)234mm
Weight		about 25kg

Need a Sales Representative?

<<< Go Back